View SAA6579_130749.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
SAA6579 Radio Data System (RDS) demodulator
Product specification Supersedes data of January 1994 File under Integrated Circuits, IC01 1997 Feb 24
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
FEATURES * Anti-aliasing filter (2nd order) * Integrated 57 kHz band-pass filter (8th order) * Reconstruction filter (2nd order) * Clocked comparator with automatic offset compensation * 57 kHz carrier regeneration * Synchronous demodulator for 57 kHz modulated RDS signals * Selectable 4.332/8.664 MHz crystal oscillator with variable dividers * Clock regeneration with lock on biphase data rate * Biphase symbol decoder with integrate and dump functions * Differential decoder * Signal quality detector * Subcarrier output. QUICK REFERENCE DATA SYMBOL VDDA VDDD Itot Vi(rms) VOH VOL Tamb PARAMETER analog supply voltage (pin 5) digital supply voltage (pin 12) total supply current RDS input amplitude (RMS value; pin 4) HIGH level output voltage for signals RDDA, RDCL, QUAL and T57 LOW level output voltage for signals RDDA, RDCL, QUAL and T57 operating ambient temperature MIN. 3.6 3.6 - 1 4.4 - -40 TYP. 5.0 5.0 6 - - - - GENERAL DESCRIPTION
SAA6579
The integrated CMOS circuit SAA6579 is an RDS demodulator. It recovers the additional inaudible RDS information which is transmitted by FM radio broadcasting. The data signal RDDA and the clock signal RDCL are provided as outputs for further processing by a suitable decoder (microcomputer). The operational functions of the device are in accordance with the "CENELEC EN 50067".
MAX. 5.5 5.5 - - - 0.4 +85
UNIT V V mA mV V V C
ORDERING INFORMATION TYPE NUMBER SAA6579 SAA6579T PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 7.5 mm VERSION SOT38-1 SOT162-1
1997 Feb 24
2
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
BLOCK DIAGRAM
SAA6579
handbook, full pagewidth
47 pF 4.332/8.664 MHz
82 pF +5 V 2.2 k OSCI 13 OSCO 14
0.1 F
VDDD 12
MPX signal
MUX 4 330 pF SCOUT 8 560 pF CIN 7
ANTIALIASING FILTER
57 kHz BANDPASS (8th ORDER)
RECONSTRUCTION FILTER
OSCILLATOR AND DIVIDER
QUALITY BIT GENERATOR
1 QUAL
CLOCKED COMPARATOR
COSTAS LOOP VARIABLE AND FIXED DIVIDER
BIPHASE SYMBOL DECODER
DIFFERENTIAL 2 DECODER 16
RDDA
+5 V
VDDA 5
0.1 F
SAA6579
VP1 CLOCK REGENERATION AND SYNC
RDCL
Vref 3
REFERENCE VOLTAGE
TEST LOGIC AND OUTPUT SELECTOR SWITCH
15
T57
2.2 F
6 VSSA
9 MODE
10 TEST
11 VSSD
MEH162
Via pin MODE two different crystal frequencies can be used.
MODE LOW HIGH
CRYSTAL CLOCK 4.332 MHz 8.664 MHz Fig.1 Block diagram and application circuit.
1997 Feb 24
3
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
PINNING SYMBOL QUAL RDDA Vref MUX VDDA VSSA CIN SCOUT MODE TEST VSSD VDDD OSCI OSCO T57 RDCL PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 quality indication output RDS data output reference voltage output (0.5VDDA) multiplex signal input +5 V supply voltage for analog part ground for analog part (0 V) subcarrier input to comparator subcarrier output of reconstruction filter oscillator mode/test control input test enable input ground for digital part (0 V) +5 V supply voltage for digital part oscillator input oscillator output 57 kHz clock signal output RDS clock output DESCRIPTION
SAA6579
handbook, halfpage
handbook, halfpage
QUAL 1 RDDA 2 Vref 3 MUX 4
16 RDCL 15 T57 14 OSCO 13 OSCI
QUAL 1 RDDA 2 Vref 3 MUX 4
16 RDCL 15 T57 14 OSCO 13 OSCI
SAA6579
VDDA 5 VSSA 6 CIN 7 SCOUT 8
MGD684
SAA6579T
12 VDDD 11 VSSD 10 TEST 9 MODE VDDA 5 VSSA 6 CIN 7 SCOUT 8
MGD685
12 VDDD 11 VSSD 10 TEST 9 MODE
Fig.2 Pin configuration.
Fig.3 Pin configuration.
1997 Feb 24
4
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
SAA6579
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); ground pins 6 and 11 connected together. SYMBOL VDDA VDDD Vn Tstg Tamb Ves PARAMETER analog supply voltage (pin 5) digital supply voltage (pin 12) voltage on all pins; grounds excluded storage temperature operating ambient temperature electrostatic handling for all pins except pins 9 and 10 note 1 note 2 CONDITIONS 0 0 -0.5 -40 -40 300 +1500 MIN. 6 6 VDDX + 0.5 +150 +85 - -3000 MAX. V V V C C V V UNIT
Notes 1. Equivalent to discharging a 200 pF capacitor via a 0 series resistor. 2. Equivalent to discharging a 100 pF capacitor via a 1.5 k series resistor. FUNCTIONAL DESCRIPTION The SAA6579 is a demodulator circuit for RDS applications. It contains a 57 kHz bandpass filter and a digital demodulator to regenerate the RDS data stream out of the multiplex signal (MPX). Filter part The MUX signal is band-limited by a second-order anti-aliasing-filter and fed through a 57 kHz band-pass filter (8th order band-pass filter with 3 kHz bandwidth) to separate the RDS signals. This filter uses switched capacitor technique and is clocked by a clock frequency of 541.5 kHz derived from the 4.332/8.664 MHz crystal oscillator. Then the signal is fed to the reconstruction filter to smooth the sampled and filtered RDS signal before it is output on pin 8. The signal is AC-coupled to the comparator (pin 7). The comparator is clocked with a frequency of 228 kHz (synchronized by the 57 kHz of the demodulator). Digital part The synchronous demodulator (Costas loop circuit) with carrier regeneration demodulates the internal coupled, digitized signal. The suppressed carrier is recovered from the two sidebands (Costas loop). The demodulated signal is low-pass-filtered in such a way that the overall pulse shape (transmitter and receiver) approaches a cosinusoidal form in conjunction with the following Integrate and dump circuit. The data-spectrum shaping is split into two equal parts and handled in the transmitter and in the receiver. Ideally, the data filtering should be equal in both of these parts. The overall data-channel-spectrum shaping of the transmitter and the receiver is approximately 100% roll-off. The Integrate and dump circuit performs an integration over a clock period. This results in a demodulated and valid RDS signal in form of biphase symbols being output from the integrate and dump circuit. The final stages of RDS data processing are the biphase symbol decoding and the differential decoding. After synchronization by data clock RDCL (pin 16) data appears on the RDDA output (pin 2). The output of the biphase symbol decoder is evaluated by a special circuit to provide an indication of good data (QUAL = HIGH) or corrupt data (QUAL = LOW). Timing Fixed and variable dividers are applied to the 4.332/8.664 MHz crystal oscillator to generate the 1.1875 kHz RDS clock RDCL, which is synchronized by the incoming data. Which ever clock edge is considered (positive or negative going edge) the data will remain valid for 399 s after the clock transition. The timing of data change is 4 s before a clock change. Which clock transition (positive or negative going clock) the data change occurs in, depends on the lock conditions and is arbitrary (bit slip). During poor reception it is possible that faults in phase occur, then the clock signal stays uninterrupted, and data is constant for 1.5 clock periods. Normally, faults in phase do not occur on a cyclic basis. If however, faults in phase occur in this way, the minimum spacing between two possible faults in phase depends on the data being transmitted. The minimum spacing cannot be less than 16 clock periods. The quality bit changes only at the time of a data change. 5
1997 Feb 24
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
CHARACTERISTICS VDDA = VDDD = 5 V; Tamb = 25 C and measurements taken in Fig.1; unless otherwise specified. SYMBOL VDDA VDDD Itot Vref Vi MPX(rms) Vi MPX(p-p) PARAMETER analog supply voltage (pin 5) digital supply voltage (pin 12) total supply current reference voltage (pin 3) I5 + I12 VDDA = 5 V f = 1.2 kHz RDS; f = 3.5 kHz ARI; see Fig.5 f = 57 2 kHz f < 50 kHz f < 15 kHz f > 70 kHz R4-6 G8-4 fc B G input resistance signal gain f = 0 to 100 kHz f = 57 kHz Tamb = -40 to +85 C f = 7 kHz f < 45 kHz f < 20 kHz f > 70 kHz Ro(8) output resistance (pin 8) f = 57 kHz CONDITIONS MIN. 3.6 3.6 - - TYP. 5.0 5.0 6 2.5 - - - - - - 20
SAA6579
MAX. 5.5 5.5 - - - - - - - - 23
UNIT V V mA V
MPX input (signal before the capacitor on pin 4) RDS amplitude (RMS value) maximum input signal capability (peak-to-peak value) 1 200 1.4 2.8 3.5 40 17 mV mV V V V k dB
57 kHz band-pass filter centre frequency -3 dB bandwidth stop band gain 56.5 2.5 31 40 50 40 - - 70 57.0 3.0 - - - - 26 57.5 3.5 - - - - - kHz kHz dB dB dB dB
Comparator input (pin 7) Vi(rms) Ri VIH VIL II minimum input level (RMS value) input resistance f = 57 kHz 1 110 - - - 10 150 - 1.0 1 mV k
Oscillator input (pin 13) HIGH level input voltage LOW level input voltage input current VDDD = 5.0 V VDDD = 5.0 V VDDD = 5.5 V 4.0 - - V V A
1997 Feb 24
6
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
SAA6579
SYMBOL
PARAMETER
CONDITIONS IQ = -20 A; VDDD = 4.5 V IQ = 3.2 mA; VDDD = 5.5 V
MIN. - - -
TYP.
MAX. - 0.4 18 - - - - - - - 20 25 - 60 - - 30 30 - 60
UNIT
Digital demodulator and outputs QUAL, RDDA, T57, OSCO and RDCL (pins 1, 2, 14, 15 and 16) VOH VOL fRDCL tRDCL fT57 IO HIGH level output voltage LOW level output voltage nominal clock frequency RDCL jitter of RDCL nominal subcarrier frequency T57 output current OSCO (pin 14) output current QUAL, RDDA, T57, RDCL (pins 1, 2, 15 and 16) 4.332 MHz crystal parameters f0 fmax fo CL Rxtal f0 fmax fo CL Rxtal Note 1. The signal T57 has a phase lead of 123 (180) relative to the ARI carrier at output SCOUT. XTAL frequency maximum permitted tolerance adjustment tolerance of f0 load capacitance resonance resistance Tamb = 25 C Tamb = -40 to +85 C - - - - - - - - Tamb = 25 C Tamb = -40 to +85 C load capacitance resonance resistance - - - - 4.332 50 - - 30 - MHz 10-6 10-6 10-6 pF note 1 VDDD = 4.5 V; V14 = 0.4 V VDDD = 4.5 V; V14 = 4.1 V VDDD = 4.5 V; V14 = 0.4 V VDDD = 4.5 V; V14 = 4.1 V 4.4 - - - - 1.5 -1.6 5.9 -5.3 V V Hz s kHz mA mA mA mA
1187.5 - 57.0 - - - -
8.664 MHz crystal parameters XTAL frequency maximum permitted tolerance adjustment tolerance of f0 8.664 50 - - 30 - MHz 10-6 10-6 10-6 pF
1997 Feb 24
7
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
SAA6579
handbook, full pagewidth
RDCL
RDDA, QUAL
MEH163
4 s
842 s
421 s
4 s
Fig.4 RDS timing diagram including a phase jump.
MGD683
handbook, full pagewidth
100
correct blocks (%) 75
50
25
(1) (2)
0 10-1 (1) RDS + ARI (BK). (2) RDS only.
1
Vi (RDS signal, RMS value) (mV)
10
Fig.5 Typical RDS sensitivity.
1997 Feb 24
8
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SAA6579
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
1997 Feb 24
9
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
SAA6579
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.043 0.043 0.055 0.016 0.039
0.035 0.004 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1997 Feb 24
10
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
SAA6579
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Feb 24
11
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA6579
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Feb 24
12
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
NOTES
SAA6579
1997 Feb 24
13
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
NOTES
SAA6579
1997 Feb 24
14
Philips Semiconductors
Product specification
Radio Data System (RDS) demodulator
NOTES
SAA6579
1997 Feb 24
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/1200/02/pp16
Date of release: 1997 Feb 24
Document order number:
9397 750 00913

▲Up To Search▲

Price & Availability of SAA6579

	To Download SAA6579 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .